Forced Liquid Cooling System Using Thin Planar ECF Pump for High Power Electronic Chips

被引：0
|
作者：
Yokota, S. [1 ]
Yoshida, K. [1 ]
Seo, W. -S. [2 ]
Koizumi, K. [1 ]
Kim, J. W. [1 ]
Edamura, K. [3 ]
机构：
[1] Tokyo Inst Technol, Midori Ku, Yokohama, Kanagawa 227, Japan
[2] Korea Inst Machinery & Mat, Daejeon, South Korea
[3] New Technol Management Co Ltd, Tokyo, Japan
来源：
ACTUATOR 08, CONFERENCE PROCEEDINGS | 2008年
关键词：
cooling system; ECF (electro-conjugate fluid); planar pump; thermal management; electronic chip;
D O I：
暂无
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
The paper presents a novel forced liquid cooling system using thin planar ECF pump for high power electronic chips such as CPUs in notebook Computers. The ECF (electro-conjugate fluid) is a kind of dielectric functional fluids, which generates jet flows (ECF-jets) in static inhomogeneous electric field. The ECF pump utilizing the ECF-jets features simple and ultra-slim planar structure without moving parts, no vibration, and no noise. For higher performance, various shapes of the electrodes are patterned on the substrates with 90 x 11 mm(2) in size and flow rate and pressure of the ECF pump are evaluated. Then a forced-liquid cooling system is constructed with the ECF pump and the cooling performance is experimentally investigated. As a result, it is confirmed that the system can remove input thermal power up to 80 W keeping the chip surface temperature below 80 degrees C.
引用
收藏
页码：226 / +
页数：2
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