Spatially resolved thickness analysis of microscale structures using micro-Raman spectroscopy

被引:1
|
作者
Wu, Xiaoming [1 ]
Ren, Tianling
Liu, Litian
Yu, Jianyuan
机构
[1] Tsinghua Univ, Inst Microelect, Beijing 100084, Peoples R China
[2] Tsinghua Univ, Anal Ctr, Beijing 100084, Peoples R China
关键词
D O I
10.1063/1.2396908
中图分类号
O59 [应用物理学];
学科分类号
摘要
A novel method, by using micro-Raman spectroscopy, is developed to measure the thickness of microelectromechanical system structures with high spatial resolution. When a microscale structure is heated by a laser, the temperature rise of the structure depends on the structure thickness and material properties. Therefore, the structure thickness can be measured using Raman shift, which is a function of temperature. Micro-Raman spectrometer is capable of measuring the thickness distribution of microscale structures with micron spatial resolution. This technique is evaluated by characterizing the thickness distribution of a single-crystal silicon (c-Si) membrane. The measured thickness distributions are verified by scanning electron microscope measurement. (c) 2006 American Institute of Physics.
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页数:3
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