3-Layer Stacked Voltage-Domain Global Shutter CMOS Image Sensor with 1.8μm-Pixel-Pitch

被引:1
|
作者
Kim, Seung-Sik [1 ]
Lee, Gwi-Deok Ryan [1 ]
Park, Sang-Su [1 ]
Shim, Heesung [1 ]
Kim, Dae-Hoon [1 ]
Choi, Minjun [1 ]
Kim, Sangyoon [1 ]
Park, Gyunha [1 ]
Oh, Seung-Jae [1 ]
Moon, Joosung [1 ]
Park, Sungbong [1 ]
Yoon, Sol [1 ]
Jeong, Jihye [1 ]
Park, Sejin [1 ]
Lee, Sanggwon [1 ]
Lee, HaeJung [1 ]
Ryu, Wonoh [1 ]
Kim, Taehyoung [1 ]
Kwon, Doowon [1 ]
Choi, Hyuk Soon [1 ]
Kim, Hongki [1 ]
Go, Jonghyun [1 ]
Kim, JinGyun [1 ]
Lim, Seunghyun [1 ]
Na, HoonJoo [1 ]
Lee, Jae-Kyu [1 ]
Moon, Chang-Rok [1 ]
Song, Jaihyuk [1 ]
机构
[1] Samsung Elect, Hwaseong, South Korea
关键词
D O I
10.1109/IEDM45625.2022.10019515
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A voltage-domain global shutter image sensor with 1.8 mu m-pixel-pitch was fabricated based on a 3-layer stacking scheme enabled by pixel-level Cu-to-Cu bonding processes. Excellent sensor performances i.e. ultra-low parasitic light sensitivity less than -130dB, 1.8e-rms of temporal noise, and 14ke- of full-well capacity were achieved, thanks to high-capacity DRAM capacitors, dual vertical-channel transfer gates and high conversion gain (mu V/e-) in a floating diffusion node. It is, to our best knowledge, the smallest global shutter pixel ever reported with superior pixel performances.
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页数:4
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