The Impact of Process Conditions on Surge Current Capability of 1.2 kV SiC JBS and MPS Diodes

被引：8
|
作者：
Xu, Hongyi [1 ]
Ren, Na [1 ,2 ]
Wu, Jiupeng [1 ]
Zhu, Zhengyun [1 ]
Guo, Qing [1 ]
Sheng, Kuang [1 ]
机构：
[1] Zhejiang Univ, Coll Elect Engn, Hangzhou 310027, Peoples R China
[2] Zhejiang Univ, Hangzhou Global Sci & Technol Innovat Ctr, Hangzhou 311200, Peoples R China
来源：
MATERIALS | 2021年 / 14卷 / 03期
关键词：
SiC; JBS; MPS; implantation; surge; IMPLANTATION;
D O I：
10.3390/ma14030663
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
This paper demonstrated the impact of process conditions on the surge current capability of 1.2 kV SiC junction barrier Schottky diode (JBS) and merged PiN Schottky diode (MPS). The influence of ohmic contact and defect density produced by implantation was studied in the simulation. The device fabricated with high temperature implantation had less defect density in the implant region compared with room temperature implantation, which contributed to higher hole injection in surge current mode and 20% surge capability improvement. In addition, with lower P+ ohmic contact resistance, the device had higher surge capability. When compared to device fabrication with a single Schottky metal layer in the device active area, adding additional P+ ohmic contact on top of the P+ regions in the device active area resulted in the pn junctions sharing a greater portion of surge current, and improved the devices' surge capability by similar to 10%.
引用
收藏
页码：1 / 13
页数：15
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