Review of the Effects of Surface Topography, Surface Chemistry, and Fluid Physics on Evaporation at the Contact Line (vol 196, pg 658, 2009)

被引：0

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作者：

Plawsky, Joel L.

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来源：

CHEMICAL ENGINEERING COMMUNICATIONS | 2009年 / 196卷 / 12期

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D O I：

10.1080/00986440903191597

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

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页码：1559 / 1559

页数：1

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