共 6 条
- [1] Investigation of mechanical properties of black diamond™ (low-K) thin films for Cu/low-k interconnect applications EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2006, : 63 - 69
- [2] Plasma enhanced CVD low-k Black Diamond™ film formation process for 65mn technology node ADVANCED METALLIZATION CONFERENCE 2003 (AMC 2003), 2004, : 543 - 547