Self-assembly nanostructured gold for high aspect ratio silicon microstructures by metal assisted chemical etching

被引：34
|
作者：
Romano, L. [1 ,2 ,3 ]
Kagias, M. [3 ,4 ,5 ]
Jefimovs, K. [3 ,4 ,5 ]
Stampanoni, M. [3 ,4 ,5 ]
机构：
[1] Catania Univ, Dept Phys, 64 Via S Sofia, I-95023 Catania, Italy
[2] Catania Univ, CNR IMM, 64 Via S Sofia, I-95023 Catania, Italy
[3] Paul Scherrer Inst, Swiss Light Source, CH-5232 Villigen, Switzerland
[4] Univ Zurich, Inst Biomed Engn, CH-8092 Zurich, Switzerland
[5] ETH, CH-8092 Zurich, Switzerland
来源：
RSC ADVANCES | 2016年 / 6卷 / 19期
关键词：
CATALYST MOTION;
D O I：
10.1039/c5ra24947c
中图分类号：
O6 [化学];
学科分类号：
0703 ;
摘要：
Self-assembly gold nanostructured membranes are created to mechanically stabilize the catalyst movement during metal assisted chemical etching. This results in an improved vertical control of the etching profile for high aspect ratio silicon microstructures. The new method is a robust and cheap microfabrication for dense micro-patterns on a large area, such as diffraction gratings for hard X-ray phase contrast imaging and metrology.
引用
收藏
页码：16025 / 16029
页数：5
相关论文
共 50 条
  • [31] Fabrication of ultra-high aspect ratio (> 160: 1) silicon nanostructures by using Au metal assisted chemical etching
    Li, Hailiang
    Ye, Tianchun
    Shi, Lina
    Xie, Changqing
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2017, 27 (12)
  • [32] Inverse Metal-Assisted Chemical Etching Produces Smooth High Aspect Ratio InP Nanostructures
    Kim, Seung Hyun
    Mohseni, Parsian K.
    Song, Yi
    Ishihara, Tatsumi
    Li, Xiuling
    NANO LETTERS, 2015, 15 (01) : 641 - 648
  • [33] High-Aspect-Ratio Silicon Nanostructures on N-type Silicon Wafer Using Metal-Assisted Chemical Etching (MACE) Technique
    Razak, Nurul Huda Abdul
    Amin, Nowshad
    Kiong, Tiong Sieh
    Sopian, Kamaruzzaman
    Akhtaruzzaman, Md
    2021 IEEE 48TH PHOTOVOLTAIC SPECIALISTS CONFERENCE (PVSC), 2021, : 2596 - 2599
  • [34] Raman spectroscopy of nanostructured silicon fabricated by metal-assisted chemical etching
    Iatsunskyi, Igor
    Jurga, Stefan
    Smyntyna, Valentyn
    Pavlenko, Mykolai
    Myndrul, Valeriy
    Zaleska, Anastasia
    OPTICAL MICRO- AND NANOMETROLOGY V, 2014, 9132
  • [35] Hierarchical silicon nanostructured arrays via metal-assisted chemical etching
    Lin, Hao
    Fang, Ming
    Cheung, Ho-Yuen
    Xiu, Fei
    Yip, Senpo
    Wong, Chun-Yuen
    Ho, Johnny C.
    RSC ADVANCES, 2014, 4 (91): : 50081 - 50085
  • [36] HIGH ASPECT RATIO DEEP SILICON ETCHING
    Owen, K. J.
    VanDerElzen, B.
    Peterson, R. L.
    Najafi, K.
    2012 IEEE 25TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS), 2012,
  • [37] Etching high aspect ratio silicon trenches
    Panda, S
    Ranade, R
    Mathad, GS
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2003, 150 (10) : G612 - G616
  • [38] Etching high aspect ratio silicon trenches
    Panda, S
    Ranade, R
    Mathad, GS
    PLASMA PROCESSING XIV, 2002, 2002 (17): : 210 - 217
  • [39] High Aspect Ratio TSVs Fabricated by Magnetic Self-assembly of Gold-coated Nickel Wires
    Fischer, A. C.
    Bleiker, S. J.
    Somjit, N.
    Roxhed, N.
    Haraldsson, T.
    Stemme, G.
    Niklaus, F.
    2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 541 - 547
  • [40] High Aspect Ratio Sub-100 nm Silicon Vias (SVs) by Metal-assisted Chemical Etching (MaCE) and Copper Filling
    Li, Liyi
    Wong, C. P.
    2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 2326 - 2331
12345