Intel goes 3D to cut leaks

被引：0
|
作者：
不详
机构：
来源：
ELECTRONICS WORLD | 2002年 / 108卷 / 1800期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：6 / 6
页数：1
相关论文
共 50 条
  • [31] Fluid dynamics data goes into 3D stereo
    2005, Institution of Mechanical Engineers (18)
  • [32] 3D micro-inspection goes DMD
    Bitte, F
    Dussler, G
    Pfeifer, T
    OPTICS AND LASERS IN ENGINEERING, 2001, 36 (02) : 155 - 167
  • [33] One-shot learning goes 3D
    Zhao, Zijian
    Deng, Shan
    Jiang, Zhouhang
    Ni, Kai
    NATURE ELECTRONICS, 2021, 4 (12) : 866 - 867
  • [34] One-shot learning goes 3D
    Zijian Zhao
    Shan Deng
    Zhouhang Jiang
    Kai Ni
    Nature Electronics, 2021, 4 : 866 - 867
  • [35] Fluid dynamics data goes into 3D stereo
    不详
    PROFESSIONAL ENGINEERING, 2005, 18 (13) : 45 - 45
  • [36] Using Intel Streaming SIMD extensions for 3D geometry processing
    Ma, WC
    Yang, CL
    ADVANCES IN MULTIMEDIA INFORMATION PROCESSING - PCM 2002, PROCEEDING, 2002, 2532 : 1080 - 1087
  • [37] Electromagnetic Simulations with 3D FEM and Intel Optane Persistent Memory
    Jakubowski, Maciej
    Sypek, Piotr
    2022 24TH INTERNATIONAL MICROWAVE AND RADAR CONFERENCE (MIKON), 2022,
  • [38] An interactive 3D visualization system based on PC using Intel SIMD, 3D texturing and thinning techniques
    Yuan Feiniu
    Liao Guangxuan
    Fan Weicheng
    Lang Wenhui
    Liu Zhengmin
    INTERNATIONAL JOURNAL OF PATTERN RECOGNITION AND ARTIFICIAL INTELLIGENCE, 2006, 20 (03) : 393 - 416
  • [39] Scalability of 3D deterministic particle transport on the Intel MIC architecture
    Wang Qing-Lin
    Liu Jie
    Gong Chun-Ye
    Xing Zuo-Cheng
    NUCLEAR SCIENCE AND TECHNIQUES, 2015, 26 (05)
  • [40] Parallel 3D Deterministic Particle Transport on Intel MIC Architecture
    Wang, Qinglin
    Xing, Zuocheng
    Liu, Jie
    Qiang, Xiaogang
    Gong, Chunye
    Jiang, Jiang
    2014 INTERNATIONAL CONFERENCE ON HIGH PERFORMANCE COMPUTING & SIMULATION (HPCS), 2014, : 186 - 192
12345