Cells under stress: a non-destructive evaluation of adhesion by ultrasounds

被引:8
|
作者
Myrdycz, A
Callens, D [1 ]
Kot, K
Monchau, F
Radziszewski, E
Lefebvre, A
Hildebrand, HF
机构
[1] Univ Valenciennes, N Inst Electron & Microelect, Dept Optoacoustoelect, UMR CNRS 8520, F-59313 Valenciennes 9, France
[2] Fac Med H Warembourg, UPRES EA 1049, Lab Biomat Res, Dept Biophys, F-59405 Lille, France
来源
BIOMOLECULAR ENGINEERING | 2002年 / 19卷 / 2-6期
关键词
cell adhesion; osteoblast; ultrasound; acoustical power threshold; interferometry laser;
D O I
10.1016/S1389-0344(02)00035-7
中图分类号
Q5 [生物化学];
学科分类号
071010 ; 081704 ;
摘要
The adhesion process plays a major role in the development of osteoblastic cells on various substrates used in orthopaedic applications such as metals, bioceramics, or glass. High frequency and low power ultrasounds seem to be an appropriate tool for an evaluation of interface mechanical properties. Is it a non-destructive method? We investigated osteoblastic cell cultures, maintained in their medium with high frequency, bulk longitudinal waves. The influence of both acoustical frequency and acoustical power on cell adhesion is evaluated by cell detachment ratio and re-adhesion ratio. We demonstrate the existence of a power threshold depending on the frequency, allowing optimal cellular detachment and re-adhesion. Finally, a qualitative study of the detachment phenomena is performed by use of scanning electron microscopy (SEM), Confocal Laser Scanning Microscopy and cytochemical labelling. (C) 2002 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:219 / 225
页数:7
相关论文
共 50 条
  • [21] Engineering Doctorate in non-destructive evaluation
    不详
    INSIGHT, 2006, 48 (03) : 132 - 132
  • [22] HTc SQUID for non-destructive evaluation
    Pagano, S
    Sarnelli, E
    Camerlingo, C
    Monaco, A
    Russo, M
    Peluso, G
    Pepe, G
    Ruosi, A
    Valentino, M
    Teti, R
    Buonadonna, P
    Maritato, L
    Salvato, M
    Prencipe, M
    ELECTROMAGNETIC NONDESTRUCTIVE EVALUATION (II), 1998, 14 : 206 - 214
  • [23] Non-destructive evaluation of engineering ceramics
    Kishi, T
    Koo, JH
    SCIENCE OF ENGINEERING CERAMICS II, 1999, 2 : 587 - 592
  • [24] Non-destructive evaluation by permeance testing
    Smith, ED
    Hancke, GP
    Smit, PC
    ISIE '97 - PROCEEDINGS OF THE IEEE INTERNATIONAL SYMPOSIUM ON INDUSTRIAL ELECTRONICS, VOLS 1-3, 1997, : 983 - 986
  • [25] Non-Destructive Evaluation of Engineering Ceramics
    Res. Ctr. for Adv. Sci. and Technol., University of Tokyo, 4-6-1 Komaba, Meguro-ku, Tokyo 153, Japan
    Key Eng Mat, (587-592):
  • [26] ULTRASONIC TOMOGRAPHY FOR NON-DESTRUCTIVE EVALUATION
    EBERHARD, JW
    ANNUAL REVIEW OF MATERIALS SCIENCE, 1982, 12 : 1 - 21
  • [27] Non-Destructive Testing for Building Evaluation
    Sadowski, Lukasz
    BUILDINGS, 2022, 12 (07)
  • [28] Electromagnetic Non-Destructive Evaluation (XXIII)
    Tian, Guiyun
    Gao, Bin
    Studies in Applied Electromagnetics and Mechanics, 2020, 45
  • [29] Special Issue on Non-destructive Evaluation
    Krishnan Balasubramanian
    B. P. C. Rao
    Transactions of the Indian Institute of Metals, 2019, 72 : 2901 - 2901
  • [30] FUTURE GROWTH OF NON-DESTRUCTIVE EVALUATION
    PAPADAKIS, EP
    MATERIALS EVALUATION, 1983, 41 (10) : 1130 - &