Smart Sensing for IoT Applications

被引：0
|
作者：
Lee, Wai [1 ]
Sharma, Ajit [1 ]
机构：
[1] Texas Instruments Inc, 12500 TI Blvd, Dallas, TX 75243 USA
来源：
2016 13TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT) | 2016年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Large scale deployment of sensing nodes for Internet of Things (IoT) applications will be an energy constrained system. To improve the energy efficiency in such systems, making sensors more intelligent will be an important tool. In this paper, we will discuss three emerging trends for smart sensing: (I) Integration of sensing elements with low-power in-situ signal processing on the same chip or package, (2) Integration of multiple sensing modalities on the same chip or package to provide more useful data to the end application, and (3) Compressive sensing techniques to extract the useful information from raw sensor output.
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页码：362 / 364
页数：3
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