<bold>Thermal-Aware Scheduling: A solution for Future Chip Multiprocessors Thermal Problems</bold>

被引:0
|
作者
Stavrou, Kyrlakos [1 ]
Trancoso, Pedro [1 ]
机构
[1] Univ Cyprus, Dept Comp Sci, 75 Kallipoleos Ave,POB 20537, CY-1678 Nicosia, Cyprus
关键词
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
The increased complexity and operating frequency in current microprocessors is resulting in a decrease in the performance improvements. In order to keep up with the expected performance gains, major manufacturers have started to offer chip-multiprocessor architectures. Nevertheless, the integration of several cores on the same chip leads to increased heat dissipation and consequently additional costs, decrease of the reliability, and performance loss, among others. In this paper we propose Thermal-Aware Scheduling (TAS) a technique that aims to minimize all these problems. When assigning processes to cores, TAS takes their temperature into account avoiding thermal violation events. As a side effect, the performance is improved. Simulation results show that for a 25-core CMP a simple TAS heuristic reduces the performance loss that is introduced by excessive temperature, from 52% to 18%. At the same time, TAS decreases the chip's temperature by 2.6 degrees C.
引用
收藏
页码:123 / +
页数:2
相关论文
共 50 条
  • [41] Thermal-Aware SoC Test Scheduling with Test Set Partitioning and Interleaving
    Zhiyuan He
    Zebo Peng
    Petru Eles
    Paul Rosinger
    Bashir M. Al-Hashimi
    Journal of Electronic Testing, 2008, 24 : 247 - 257
  • [42] Thermal-Aware Scheduling for MPSoC in the Avionics Domain: Tooling and Initial Results
    Benedikt, Ondrej
    Sojka, Michal
    Zaykov, Pavel
    Hornof, David
    Kafka, Matej
    Sucha, Premysl
    Hanzalek, Zdenek
    2021 IEEE 27TH INTERNATIONAL CONFERENCE ON EMBEDDED AND REAL-TIME COMPUTING SYSTEMS AND APPLICATIONS (RTCSA 2021), 2021, : 159 - 168
  • [43] Thermal-Aware Task Scheduling for 3D Multicore Processors
    Zhou, Xiuyi
    Yang, Jun
    Xu, Yi
    Zhang, Youtao
    Zhao, Jianhua
    IEEE TRANSACTIONS ON PARALLEL AND DISTRIBUTED SYSTEMS, 2010, 21 (01) : 60 - 71
  • [44] Regulating CPU temperature with thermal-aware scheduling using a reduced order learning thermal model
    Dowling, Anthony
    Jiang, Lin
    Cheng, Ming-Cheng
    Liu, Yu
    FUTURE GENERATION COMPUTER SYSTEMS-THE INTERNATIONAL JOURNAL OF ESCIENCE, 2025, 166
  • [45] Thermal-Aware Scheduling of Batch Jobs in Geographically Distributed Data Centers
    Polverini, Marco
    Cianfrani, Antonio
    Ren, Shaolei
    Vasilakos, Athanasios V.
    IEEE TRANSACTIONS ON CLOUD COMPUTING, 2014, 2 (01) : 71 - 84
  • [46] Thermal-aware application scheduling on device-heterogeneous embedded architectures
    Swaminathan, Karthik
    Kotra, Jagadish
    Liu, Huichu
    Sampson, Jack
    Kandemir, Mahmut
    Narayanan, Vijaykrishnan
    2015 28TH INTERNATIONAL CONFERENCE ON VLSI DESIGN (VLSID), 2015, : 221 - 226
  • [47] A Fast Scheme to Investigate Thermal-Aware Scheduling Policy for Multicore Processors
    He, Liqiang
    Narisu, Cha
    ADVANCED PARALLEL PROCESSING TECHNOLOGIES, PROCEEDINGS, 2009, 5737 : 1 - 10
  • [48] Thermal-aware SoC test scheduling with test set partitioning and interleaving
    He, Zhiyuan
    Peng, Zebo
    Eles, Petru
    Rosinger, Paul
    Al-Hashimi, Bashir M.
    21ST IEEE INTERNATIONAL SYMPOSIUM ON DEFECT AND FAULT-TOLERANCE IN VLSI SYSTEMS, PROCEEDINGS, 2006, : 477 - +
  • [49] Thermal-Aware Task Scheduling in 3D Chip Multiprocessor with Real-Time Constrained Workloads
    Li, Jiayin
    Qiu, Meikang
    Niu, Jian-Wei
    Yang, Laurence T.
    Zhu, Yongxin
    Ming, Zhong
    ACM TRANSACTIONS ON EMBEDDED COMPUTING SYSTEMS, 2013, 12 (02)
  • [50] <bold>A THERMAL MANAGEMENT AND PROFILING METHOD FOR RECONFIGURABLE HARDWARE APPLICATIONS</bold>
    Jones, Phillip H.
    Lockwood, John W.
    Cho, Young H.
    2006 INTERNATIONAL CONFERENCE ON FIELD PROGRAMMABLE LOGIC AND APPLICATIONS, PROCEEDINGS, 2006, : 103 - 109