Package Routability- and IR-Drop-Aware Finger/Pad Assignment in Chip-Package Co-Design

被引：0
|
作者：
Lu, Chao-Hung [1 ]
Chen, Hung-Ming [2 ]
Liu, Chien-Nan Jimmy [1 ]
Shih, Wen-Yu [1 ]
机构：
[1] Natl Cent Univ, Dept Elect Engn, Tao Yuan, Taiwan
[2] Natl Chiao Tung Univ, Dept Elect Engn, Hsinchu 30050, Taiwan
来源：
DATE: 2009 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION, VOLS 1-3 | 2009年
关键词：
D O I：
暂无
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
Due to increasing complexity of design interactions between the chip, package and PCB, it is essential to consider them at the same time. Specifically the finger/pad locations affect the performance of the chip and the package significantly. In this paper, we have. developed techniques in chip-package codesign to decide the locations of fingers/pads for package routability and signal integrity concerns in chip core design. Our finger/pad assignment is a two-step method: first we optimize the wire congestion problem in package routing, and then we try to minimize the IR-drop violation with finger/pad solution refinement The experimental results are encouraging. Compared with the randomly optimized methods, our approaches reduce in average 42% and 68% of the maximum density in package and 10.61% of IR-drop for test circuits.
引用
收藏
页码：845 / +
页数：2
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