Multiscale approach to study molecular and interfacial characteristics of vesicles

被引:0
|
作者
Yu, Xiang [1 ]
Dutt, Meenakshi [1 ]
机构
[1] Rutgers State Univ, Chem & Biochem Engn, Piscataway, NJ USA
关键词
D O I
暂无
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
713
引用
收藏
页数:1
相关论文
共 50 条
  • [41] Bioinspired multiscale interfacial materials with superwettability
    Wang Peng-Wei
    Liu Ming-Jie
    Jiang Lei
    ACTA PHYSICA SINICA, 2016, 65 (18)
  • [42] Bioinspired, smart, multiscale, interfacial materials
    Jiang, Lei
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2012, 243
  • [43] INVESTIGATION ON INTERFACIAL THERMAL RESISTANCES OF Al/Cu STRUCTURE BY USING HYBRID MODELING WITH MULTISCALE CHARACTERISTICS
    Yang, Ping
    Zhao, Yanfang
    Zhang, Liqiang
    Tang, Yunqingn
    Yang, Haiying
    INTERNATIONAL JOURNAL FOR MULTISCALE COMPUTATIONAL ENGINEERING, 2014, 12 (03) : 211 - 221
  • [44] STUDY OF DEFORMATION CHARACTERISTICS OF INTERFACIAL LAYER IN ORGANOCOMPOSITES
    EFREMOVA, AI
    KUZUB, LI
    LAZORENKO, VM
    IRZHAK, VM
    SHUT, NI
    MECHANICS OF COMPOSITE MATERIALS, 1988, 24 (06) : 741 - 746
  • [45] A study on characteristics of interfacial transition zone in concrete
    Liao, KY
    Chang, PK
    Peng, YN
    Yang, CC
    CEMENT AND CONCRETE RESEARCH, 2004, 34 (06) : 977 - 989
  • [46] A molecular dynamics study on the interfacial properties of millerite
    Anvari, Monir Hosseini
    Choi, Phillip
    Liu, Qingxia
    JOURNAL OF MOLECULAR LIQUIDS, 2021, 334
  • [47] Molecular dynamics study of interfacial electric fields
    Glosli, JN
    Philpott, MR
    ELECTROCHIMICA ACTA, 1996, 41 (14) : 2145 - 2158
  • [48] Ion interactions and thrombospondins, a multiscale molecular modelling study
    Haschka, T.
    Etchebest, C.
    Martiny, L.
    Dauchez, M.
    FEBS JOURNAL, 2014, 281 : 482 - 482
  • [49] INTERFACIAL PHASES ON GIANT UNILAMELLAR VESICLES
    Jiang, Yanfei
    Genin, Guy M.
    Singamaneni, Srikanth
    Elson, Elliot L.
    PROCEEDINGS OF THE ASME SUMMER BIOENGINEERING CONFERENCE, PTS A AND B, 2012, : 705 - 706
  • [50] Interfacial Properties of Cu/SiO2 using a Multiscale Modelling Approach in Electronic Packages
    Cui, Zhen
    Chen, Xianping
    Fan, Xuejun
    Zhang, Guoqi
    2018 19TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2018,