A Low-Cost Broadband Bondwire Interconnect for THz Heterogeneous System Integration

被引：0

作者：

Li, Chun-Hsing ^{[1
]}

Lai, Chih-Wei ^{[2
]}

Yan, Tzu-Chao ^{[2
]}

Kuo, Chien-Nan ^{[2
]}

机构：

[1] Natl Cent Univ, Dept Elect Engn, Jhongli, Taiwan

[2] Natl Chiao Tung Univ, Dept Elect Engn, Hsinchu, Taiwan

来源：

2015 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS) | 2015年

关键词：

Bondwire; broadband; interconnect; THz; heterogeneous integration; ARRAY;

D O I：

暂无

中图分类号：

TP301 [理论、方法];

学科分类号：

081202 ;

摘要：

A low-cost broadband bondwire interconnect is proposed for THz heterogeneous system integration. A transversal path composed of two transmission lines and a bondwire is introduced to effectively reduce the bondwire effect of an original signal path consisted of a single bondwire only. Simulation results indicate that the return loss and insertion loss can be better than 15 dB and 2.3 dB from dc to 456 GHz, respectively. Measured interconnect loss is around 0 dB to 1.5 dB from 320 to 340 GHz.

引用

页数：4

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