CMOS-Compatible Wearable Sensors Fabricated Using Controlled Spalling

被引:2
|
作者
Sakuma, Katsuyuki [1 ]
Hu, Huan [1 ,2 ,3 ]
Liu, Xiao Hu [1 ]
Ni, Jiamin [1 ]
Bedell, Stephen W. [1 ]
Webb, Bucknell [1 ]
Wright, Steven L. [1 ]
Lauro, Paul [1 ]
Latzko, Ken [1 ]
Agno, Marlon [1 ]
Tornello, James [1 ]
Knickerbocker, John U. [1 ]
机构
[1] IBM Corp, Thomas J Watson Res Ctr, POB 704, Yorktown Hts, NY 10598 USA
[2] Zhejiang Univ Univ Illinois Urbana Champaign Inst, Haining 314400, Peoples R China
[3] Zhejiang Univ, Coll Informat Sci & Elect Engn, Hangzhou 310007, Zhejiang, Peoples R China
关键词
Controlled spalling; flexible electronics; piezo-resistance; sensor; wearable; INTEGRATED-CIRCUITS; LIFT-OFF; SILICON; CRACKING; GRAPHENE; TRANSISTORS; NANOWIRES; LAYERS; EDGE; SI;
D O I
10.1109/JSEN.2019.2917278
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Wearable sensors can provide important human physiology and activity data and therefore have promising applications in healthcare, entertainment, and security. Here, we report the design, fabrication, and characterizations of a thin silicon film sensor for wearable sensor applications. Temperature, light, and strain sensing capabilities of the thin film of doped silicon, fabricated using a controlled spalling process, were fully characterized. An n-doped silicon thin-film sensor prepared with the spalling technology exhibited a temperature coefficient of -0.44%/degrees C. The sensor also showed excellent light sensin response in an illumination range from 110 to 1710 cd/mm(2). The ratio of the electrical resistance changes over the applied forces was measured to be around 0.6%/N.
引用
收藏
页码:7868 / 7874
页数:7
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