Ultratough nanocrystalline copper with a narrow grain size distribution

被引：149

作者：

Youssef, KM ^{[1
]}

Scattergood, RO ^{[1
]}

Murty, KL ^{[1
]}

Koch, CC ^{[1
]}

机构：

[1] N Carolina State Univ, Dept Mat Sci & Engn, Raleigh, NC 27695 USA

来源：

APPLIED PHYSICS LETTERS | 2004年 / 85卷 / 06期

关键词：

D O I：

10.1063/1.1779342

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

We report a unique way of using mechanical milling/in situ consolidation at both liquid-nitrogen and room temperature to produce artifact-free nanocrystalline Cu (23 nm) with a narrow grain size distribution. This nanocrystalline Cu exhibits an extraordinarily high yield strength (770 MPa), as predicted from a Hall-Petch extrapolation, along with good ductility (comparable with similar to30% uniform tensile elongation). Possible factors leading to this excellent optimization of strength and ductility are discussed. (C) 2004 American Institute of Physics.

引用

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页码：929 / 931

页数：3

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