The electrical and mechanical properties of electrically conductive adhesives in pin-through-hole applications

被引：0
|
作者：
Morris, JE
Feng, XF
Lee, CL
Oakley, E
Youssof, S
机构：
[1] Department of Electrical Engineering, T.J. Watson Sch. Eng. and Appl. Sci., State University of New York, Binghamton
来源：
JOURNAL OF ELECTRONICS MANUFACTURING | 1996年 / 6卷 / 03期
关键词：
D O I：
10.1142/S0960313196000202
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Electrically conductive adhesives have been used in place of solder for pin-through-hole attachment of dual-in-line IC packages. Joint resistances are much higher than predicted by specified resistivities, but would be adequate for most applications. Shear and fracture strengths are similar to those found for surface mount applications, and boards survive improvised impact testing. Much of the electrical data relates to resistance drifts with thermal cycling, temperature, coefficients of resistance, and dispersion due to small joint geometries.
引用
收藏
页码：219 / 230
页数：12
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