Advances in MEMS integration with planar waveguide devices

被引:3
|
作者
Kubby, JA [1 ]
机构
[1] Xerox Wilson Ctr Res & Technol, Webster, NY 14580 USA
关键词
optical integration; Photonic Light Circuits; PLC; Micro-Opto-Electro-Mechanical systems; MOEMS;
D O I
10.1117/12.463840
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper reviews benefits for the integration of optical components into Photonic Light Circuits (PLC's), with a particular emphasis on the integration of optical switching elements. The requirements for the optical switches in these circuits will be discussed and the suitability of various switching technologies for meeting these requirements will be considered.
引用
收藏
页码:1 / 12
页数:12
相关论文
共 50 条
  • [41] Diode laser bonding of planar MEMS, MOEMS, & microfluidic devices
    Chen, JW
    Zybko, J
    Clements, J
    Micro- and Nanosystems-Materials and Devices, 2005, 872 : 309 - 314
  • [42] Emerging planar waveguide devices for WDM and spectroscopy:Curved waveguide multiplexers and interferometer arrays
    Cheben, Pavel
    Bock, Przemek
    Florjanczyk, Miroslaw
    Janz, Siegfried
    Xu, Dan-Xia
    Delage, Andre
    Schmid, Jens
    Scott, Alan
    Solheim, Brian
    Densmore, Adam
    Hall, Trevor
    ICTON 2008: PROCEEDINGS OF 2008 10TH ANNIVERSARY INTERNATIONAL CONFERENCE ON TRANSPARENT OPTICAL NETWORKS, VOL 1, 2008, : 84 - +
  • [43] The Integration of Silica and Polymer Waveguide Devices for ROADM Applications
    Fujita, Junichiro
    Gerhardt, Reinald
    Izuhara, Tomoyuki
    Lin, Wenhua
    Wei, Hongzhen
    Grek, Boris
    OPTOELECTRONIC INTEGRATED CIRCUITS XIII, 2011, 7942
  • [44] Transmission characteristics of planar optical waveguide devices on coupling interface
    Zheng, Yu
    Duan, Ji-an
    OPTIK, 2013, 124 (21): : 5274 - 5279
  • [45] Process technologies of MPACVD planar waveguide devices and fiber attachment
    Li, CC
    Qian, F
    Boudreau, R
    Rowlette, J
    Bowen, T
    SILICON-BASED OPTOELECTRONICS, 1999, 3630 : 2 - 8
  • [46] Integrated Planar Waveguide Devices for Evanescent Field Sensing and Spectroscopy
    Cheben, P.
    Janz, S.
    Sabourin, N.
    Xu, D. -X.
    Ding, H.
    Wang, S.
    Schmid, J. H.
    Delage, A.
    Lapointe, J.
    Sinclair, W.
    Ma, R.
    Logan, S.
    MacKenzie, R.
    Liu, Q. Y.
    Gilmour, M.
    Halir, R.
    Ramos, C. Alonso
    Wanguemert-Perez, G.
    Ortega-Monux, A.
    Fernandez, I. Molina
    Le Roux, X.
    Laurent, L.
    Velasco, A. Villafranca
    Calvo, M. L.
    2014 16TH INTERNATIONAL CONFERENCE ON TRANSPARENT OPTICAL NETWORKS (ICTON), 2014,
  • [47] Integration possibilities with MOEMS/MEMS devices and packaging technologies using a MEMS simulation tool
    Dokmeci, M
    Kirkos, G
    OPTOELECTRONIC INTERGRATED CIRCUITS AND PACKAGING V, 2001, 4290 : 116 - 127
  • [48] MCVD planar substrates for UV-written waveguide devices
    Webb, A. S.
    Adikan, Er. Mahamd
    Sahu, J. K.
    Standish, R. J.
    Gawith, C. B. E.
    Gates, J. C.
    Smith, P. G. R.
    Payne, D. N.
    ELECTRONICS LETTERS, 2007, 43 (09) : 517 - 519
  • [49] Integration of microwave MEMS reconfigurable reflective surfaces in rectangular waveguide stubs
    Sterner, Mikael
    Chicherin, Dmitry
    Aberg, Jan
    Sauleau, Ronan
    Raisanen, Antti
    Stemme, Goran
    Oberhammer, Joachim
    2010 ASIA-PACIFIC MICROWAVE CONFERENCE, 2010, : 1825 - 1828
  • [50] Towards the integration of nano/micro devices using MEMS technology
    Fang, WL
    Hsieh, J
    Lin, HY
    NANOMECHANICS OF MATERIALS AND STRUCTURES, 2006, : 151 - +