Study of Thermal Electrical Modified Etching for Glass and Its Application in Structure Etching

被引:1
|
作者
Zhan, Zhan [1 ]
Li, Wei [1 ]
Yu, Lingke [1 ]
Wang, Lingyun [1 ]
Sun, Daoheng [1 ]
机构
[1] Xiamen Univ, Sch Aerosp Engn, 422th Siming South Rd, Xiamen 351005, Peoples R China
关键词
thermal electrical modification; accelerating etching; multi-scale structures; glass; SILICON;
D O I
10.3390/ma10020158
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
In this work, an accelerating etching method for glass named thermal electrical modified etching (TEM etching) is investigated. Based on the identification of the effect in anodic bonding, a novel method for glass structure micromachining is proposed using TEM etching. To validate the method, TEM-etched glasses are prepared and their morphology is tested, revealing the feasibility of the new method for micro/nano structure micromachining. Furthermore, two kinds of edge effect in the TEM and etching processes are analyzed. Additionally, a parameter study of TEM etching involving transferred charge, applied pressure, and etching roughness is conducted to evaluate this method. The study shows that TEM etching is a promising manufacture method for glass with low process temperature, three-dimensional self-control ability, and low equipment requirement.
引用
收藏
页数:12
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