Nanoindentation analysis of interfacial IMCs in electronic solder joints

被引：0
|
作者：
Shen, Yu-Lin [1 ]
Song, Jenn-Ming [1 ]
Su, Chien-Wei [1 ]
机构：
[1] Natl Dong Hwa Univ, Dept Mat Sci & Engn, Hualien 974, Taiwan
来源：
2008 EMAP CONFERENCE PROCEEDINGS | 2008年
关键词：
Nanoindentation; Intermetallic compounds; Strain rate sensitivity exponent;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
To evaluate the behavior of intermetallic compounds (IMCs) at different loading conditions, this study examined the hardeness and modulus of the IMCs formed at the interfaces between potential Pb-free solders (Sn-Ag-Cu and Sn-Zn) and the substrates of Cu and Ag. Compared to Ag based IMCs, Cu based IMCs are harder, stiffer, but less strain rate sensitive. It is also found that the morphology of the indent impression depends on the ratio of the modulus to hardness, and the crystal structure of the IMCs.
引用
收藏
页码：88 / 90
页数：3
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