A Test Probe for TSV using Resonant Inductive Coupling

被引：0
|
作者：
Rashidzadeh, Rashid [1 ]
Basith, Iftekhar Ibne [1 ]
机构：
[1] Univ Windsor, Dept Elect & Comp Engn, Windsor, ON, Canada
来源：
2013 25TH INTERNATIONAL TELETRAFFIC CONGRESS (ITC) | 2013年
基金：
加拿大自然科学与工程研究理事会;
关键词：
DESIGN;
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
A contactless TSV probe based on the principle of resonant inductive coupling is presented in this work. The proposed scheme allows TSV data observation up to 2Gbps when the probe and TSV are 15 mu m apart.
引用
收藏
页数：10
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