Characterization of Transmission Lines on PCB from S-Parameters by Determining the Dielectric and Conductor Losses at the Crossover Frequency

被引:3
|
作者
Teran-Bahena, Erika Y. [1 ]
Sejas-Garcia, Svetlana C. [2 ]
Torres-Torres, Reydezel [1 ]
机构
[1] Inst Nacl Astrofis Opt & Electr, Puebla 72840, Mexico
[2] Isola Grp, Chandler, AZ 85224 USA
关键词
Characteristic impedance; complex permittivity; conductor losses; dielectric losses; printed circuit board (PCB); transmission lines; PRINTED-CIRCUIT BOARDS; CHARACTERISTIC IMPEDANCE; INTERCONNECTS;
D O I
10.1109/TCPMT.2018.2824321
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Full characterization of transmission lines fabricated on printed circuit boards is presented in this paper. For this purpose, the frequency at which the attenuation curves associated with the conductor and dielectric losses cross over is first determined to exactly separate the corresponding contribution to the total attenuation. Afterward, permittivity, loss tangent, effective geometry, and rms roughness are obtained from the propagation constant and characteristic impedance data for allowing the transmission line representation up to 20 GHz. Using the extracted parameters, the excellent model-experiment correlation for the S-parameters of the lines is observed. In fact, the curves of complex-impedance versus frequency are also corrected from undesired resonances typically occurring in experimental data. Finally, it is demonstrated that the extracted parameters allow performing causal time-domain simulations.
引用
收藏
页码:867 / 874
页数:8
相关论文
共 48 条
  • [1] An Approach for Quantifying the Conductor and Dielectric Losses in PCB Transmission Lines
    Torres-Torres, Reydezel
    Vega-Gonzalez, Victor H.
    [J]. ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, 2009, : 235 - 238
  • [2] Modeling Transmission Lines on Silicon in the Frequency and Time Domains from S-Parameters
    Sejas-Garcia, Svetlana C.
    Torres-Torres, Reydezel
    Murphy-Arteaga, Roberto S.
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2012, 59 (06) : 1803 - 1806
  • [3] High-frequency modeling of frequency-dependent dielectric and conductor losses in transmission lines
    Chan, Jason E.
    Sivaprasad, Kondagunta
    Chamberlin, Kent A.
    [J]. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2007, 30 (01): : 86 - 91
  • [4] Calculating S-Parameters and Uncertainties of Coaxial Air-Dielectric Transmission Lines
    Mubarak, Faisal Ali
    Mascolo, Vincenzo
    Hussain, Faizan
    Rietveld, Gert
    [J]. IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 2024, 73 : 1 - 11
  • [5] Characterization of PCB s-parameters with a New Calibration Method
    Cheng Ning
    Resso, Mike
    Zhu Wenxue
    Jia Gongxian
    Long Faming
    [J]. 2016 ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (APEMC), 2016, : 240 - 242
  • [6] Causal RLGC(f) Models for Transmission Lines From Measured S-Parameters
    Zhang, Jianmin
    Drewniak, James L.
    Pommerenke, David J.
    Koledintseva, Marina Y.
    DuBroff, Richard E.
    Cheng, Wheling
    Yang, Zhiping
    Chen, Qinghua B.
    Orlandi, Antonio
    [J]. IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2010, 52 (01) : 189 - 198
  • [7] DETERMINING NOISE PARAMETERS OF MESFETS SOLELY FROM THEIR S-PARAMETERS
    CAI, CQ
    CAI, SZ
    [J]. INTERNATIONAL JOURNAL OF INFRARED AND MILLIMETER WAVES, 1990, 11 (05): : 685 - 698
  • [8] A Method to Extract Dielectric Parameters from Transmission Lines with Conductor Surface Roughness at Microwave Frequencies
    Huang, Binke
    Jia, Qi
    [J]. PROGRESS IN ELECTROMAGNETICS RESEARCH M, 2016, 48 : 1 - 8
  • [9] A practical method for modeling PCB transmission lines with conductor surface roughness and wideband dielectric properties
    Liang, Tao
    Hall, Stephen
    Heck, Howard
    Brist, Gary
    [J]. 2006 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-5, 2006, : 1780 - +
  • [10] Verification of Novel Extended Mixed-Mode S-Parameters on Three-Conductor Lines
    Zhang, Nan
    Nah, Wansoo
    [J]. 2015 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC), 2015, : 1319 - 1322