Evaluation of fracture behavior in metal/ceramic joint by acoustic emission

被引：0

作者：

Park, YJ ^{[1
]}

Enoki, M ^{[1
]}

Suga, T ^{[1
]}

Kishi, T ^{[1
]}

机构：

[1] Univ Tokyo, Res Ctr Adv Sci & Technol, Meguro Ku, Tokyo 1538904, Japan

来源：

NONDESTRUCTIVE CHARACTERIZATION OF MATERIALS IX | 1999年 / 497卷

关键词：

D O I：

暂无

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Fracture behavior of Al/sapphire bulk joint fabricated by SAB (surface activated room temperature bonding) was investigated by AE (acoustic emission) method. Direct bonding at atomic level without formation of reaction products restricted the sources of AE generation into interfacial debonding and aluminum fracture itself. In order to reveal the effects of bonding conditions on fracture behavior by non-destructive method, specimens having different bonded area fraction were prepared. The sequential process of interfacial defect growth and propagation of main crack was elucidated by AE source characterization and real time observation of interface through transparent sapphire. Classification of AE signals was carried out by means of source characterization, which well agreed to observed results. While the coalescence of unbonded dominated in Al 2nine(99.5%)-bonded at 40MPa, both coalescence of unbonded and ligament Al fracture resulted in crack propagation in Al 5nine(99.999%)-bonded at 20MPa.

引用

页码：21 / 26

页数：6

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