Large-area integration of two-dimensional materials and their heterostructures by wafer bonding

被引:132
|
作者
Quellmalz, Arne [1 ]
Wang, Xiaojing [1 ]
Sawallich, Simon [2 ,3 ]
Uzlu, Burkay [3 ,4 ]
Otto, Martin [4 ]
Wagner, Stefan [4 ]
Wang, Zhenxing [4 ]
Prechtl, Maximilian [5 ]
Hartwig, Oliver [5 ]
Luo, Siwei [5 ]
Duesberg, Georg S. [5 ]
Lemme, Max C. [3 ,4 ]
Gylfason, Kristinn B. [1 ]
Roxhed, Niclas [1 ]
Stemme, Goran [1 ]
Niklaus, Frank [1 ]
机构
[1] KTH Royal Inst Technol, Sch Elect Engn & Comp Sci, Div Micro & Nanosyst, Stockholm, Sweden
[2] Protemics GmbH, Aachen, Germany
[3] Rhein Westfal TH Aachen, Fac Elect Engn & Informat Technol, Chair Elect Devices, Aachen, Germany
[4] AMO GmbH, Adv Microelect Ctr Aachen AMICA, Aachen, Germany
[5] Univ Bundeswehr Munchen, Fac Elect Engn & Informat Technol, Inst Phys, EIT 2, Neubiberg, Germany
基金
欧洲研究理事会; 瑞典研究理事会;
关键词
D O I
10.1038/s41467-021-21136-0
中图分类号
O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];
学科分类号
07 ; 0710 ; 09 ;
摘要
Integrating two-dimensional (2D) materials into semiconductor manufacturing lines is essential to exploit their material properties in a wide range of application areas. However, current approaches are not compatible with high-volume manufacturing on wafer level. Here, we report a generic methodology for large-area integration of 2D materials by adhesive wafer bonding. Our approach avoids manual handling and uses equipment, processes, and materials that are readily available in large-scale semiconductor manufacturing lines. We demonstrate the transfer of CVD graphene from copper foils (100-mm diameter) and molybdenum disulfide (MoS2) from SiO2/Si chips (centimeter-sized) to silicon wafers (100-mm diameter). Furthermore, we stack graphene with CVD hexagonal boron nitride and MoS2 layers to heterostructures, and fabricate encapsulated field-effect graphene devices, with high carrier mobilities of up to 4520 cm2V-1s-1. Thus, our approach is suited for backend of the line integration of 2D materials on top of integrated circuits, with potential to accelerate progress in electronics, photonics, and sensing. The existing integration approaches for 2D materials often degrade material properties and are not compatible with industrial processing. Here, the authors devise an adhesive wafer bonding strategy to transfer and stack monolayers, suitable for back end of the line integration of 2D materials.
引用
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页数:11
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