Deposition and Fabrication of Sputtered Bismuth Telluride and Antimony Telluride for Microscale Thermoelectric Energy Harvesters

被引:16
|
作者
Haidar, Samer A. [1 ,2 ]
Gao, Yuan [2 ,3 ]
He, Yifan [2 ]
Cornett, Jane E. [1 ]
Chen, Baoxing [1 ]
Coburn, Nigel J. [4 ,5 ]
Glynn, Colm [6 ]
Dunham, Marc T. [7 ]
Goodson, Kenneth E. [7 ]
Sun, Nian [2 ]
机构
[1] Analog Devices Inc, 804 Woburn St, Wilmington, MA 01887 USA
[2] Northeastern Univ, Elect & Comp Engn, 360 Huntington Ave, Boston, MA 02115 USA
[3] Winchester Technol, 21 A St, Burlington, MA 01803 USA
[4] Analog Devices Inc, 125 Summer St, Boston, MA 02110 USA
[5] Boston Univ, Coll Engn, 44 Cummington Mall, Boston, MA 02115 USA
[6] Analog Devices Int, Raheen Business Pk, Limerick V94 RT99, Ireland
[7] Stanford Univ, Dept Mech Engn, 400 Escondido Mall, Stanford, CA 94305 USA
关键词
Bismuth telluride; Antimony telluride; Co-sputtering; Annealing; Micro-scale thermoelectric energy generator; THIN-FILMS; P-TYPE; BI2TE3; TEMPERATURE; GROWTH; RF;
D O I
10.1016/j.tsf.2020.138444
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Thermoelectric (TE) n-type bismuth telluride (Bi2Te3) films and p-type antimony telluride (Sb2Te3) films are grown on SiO2/Si substrates via radio frequency magnetron sputtering. The crystal structures and TE properties are characterized for 1 mu m and 10 mu m films deposited using different deposition conditions and using various heat treatment conditions. Single-target sputtered deposition of n-type Bi2Te3 films resulted in a Te-deficient off stoichiometric films due to the evaporation of tellurium. Two-target co-sputtered deposition using Bi2Te3 and Te targets at room temperature and subsequent anneal at 250 degrees C yielded a 10 mu m n-type film with -102 mu V/K for the Seebeck coefficient and 0.7 mW/K-2.m for the power factor. Similarly, prepared p-type Sb2Te3 film but using a single sputtering target yielded +110 mu V/K and 1.3 mW/K-2.m for their Seebeck coefficient and power factor respectively. The fabrication of the micro-scale thermoelectric energy generator (mu TEG) using separate n-type and p-type wafers is demonstrated.
引用
收藏
页数:9
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