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Electroplated Fe films prepared from a deep eutectic solvent
被引:10
|作者:
Yanai, T.
[1
]
Shiraishi, K.
[1
]
Shimokawa, T.
[1
]
Watanabe, Y.
[1
]
Ohgai, T.
[1
]
Nakano, M.
[1
]
Suzuki, K.
[2
]
Fukunaga, H.
[1
]
机构:
[1] Nagasaki Univ, Grad Sch Engn, Nagasaki 8528521, Japan
[2] Monash Univ, Dept Mat Engn, Clayton, Vic 3800, Australia
关键词:
MOLTEN LICL-KCL-SMCL3 SYSTEM;
SALT ELECTROCHEMICAL PROCESS;
NI ALLOY-FILMS;
CHOLINE CHLORIDE;
MAGNETIC-PROPERTIES;
THIN-FILMS;
CO;
ELECTRODEPOSITION;
SM;
ACID;
D O I:
10.1063/1.4870319
中图分类号:
O59 [应用物理学];
学科分类号:
摘要:
Electroplating of Fe films was carried out from choline chloride-ethylene glycol types of DES (Deep Eutectic Solvent). We investigated magnetic properties of the plated Fe films and evaluated the productivity for the electroplating process. Consequently, we found that surface morphology and current efficiency of the plated films were affected by the bath temperature. We obtained the Fe films with relatively smooth surface and high current efficiency in the bath temperature range from 70 to 110 degrees C. The deposition rate for our process depended on the current density, and we obtained high deposition rate value of approximately 120 mu m/h. We also obtained high current efficiency values of approximately 90% in the wide range of plating time. These results indicate that the DES-based bath has industrial advantages for mass-producing Fe films. Therefore, we conclude that the DES-based bath is an attractive plating bath for Fe films. (C) 2014 AIP Publishing LLC.
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