共 15 条
- [1] Power Integrity Comparison of Off-chip, On-interposer, On-chip Voltage Regulators in 2.5D/3D ICs 2019 ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS (EDAPS 2019), 2019,
- [2] Hierarchical Layout Synthesis and Design Automation for 2.5D Heterogeneous Multi-Chip Power Modules 2019 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE), 2019, : 2257 - 2263
- [3] Low-noise Design for Power Delivery Network in 2.5D Integrated Microsystem 2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
- [4] Benchmarking Frequency-Dependent Parasitics of Fine-Pitch Off-Chip I/Os for 2.5D and 3D Heterogeneous Integration IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2022, 12 (12): : 2002 - 2012
- [6] Analysis and Optimization of a Power Distribution Network in 2.5D IC with Glass Interposer 2014 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC), 2014,
- [7] Extension of 2.5D PEEC for Coplanar Structures in Power Distribution Network Analysis 2016 IEEE 20TH WORKSHOP ON SIGNAL AND POWER INTEGRITY (SPI), 2016,
- [8] Efficient Electromagnetic Modeling and Analysis for Off-Chip Interconnects in SIW Structures and 3D ICs 2014 IEEE ANTENNAS AND PROPAGATION SOCIETY INTERNATIONAL SYMPOSIUM (APSURSI), 2014, : 2114 - 2115
- [9] Design and Analysis of On-interposer Active Power Distribution Network for an Efficient Simultaneous Switching Noise Suppression in 2.5D IC 2016 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC), 2016,