Multimaterial 4D Printing with Tailorable Shape Memory Polymers

被引:783
|
作者
Ge, Qi [1 ,2 ]
Sakhaei, Amir Hosein [1 ]
Lee, Howon [2 ]
Dunn, Conner K. [3 ]
Fang, Nicholas X. [2 ]
Dunn, Martin L. [1 ]
机构
[1] Singapore Univ Technol & Design, Digital Mfg & Design Ctr, Singapore, Singapore
[2] MIT, Dept Mech Engn, Cambridge, MA 02139 USA
[3] Georgia Inst Technol, George W Woodruff Sch Mech Engn, Atlanta, GA 30332 USA
来源
SCIENTIFIC REPORTS | 2016年 / 6卷
基金
新加坡国家研究基金会;
关键词
MECHANICALLY COUPLED THEORY; REACTION-DIFFUSION; LARGE DEFORMATIONS; NETWORKS; STEREOLITHOGRAPHY; TEMPERATURE; FABRICATION; BEHAVIOR; MODEL;
D O I
10.1038/srep31110
中图分类号
O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];
学科分类号
07 ; 0710 ; 09 ;
摘要
We present a new 4D printing approach that can create high resolution (up to a few microns), multimaterial shape memory polymer (SMP) architectures. The approach is based on high resolution projection microstereolithography (P mu SL) and uses a family of photo-curable methacrylate based copolymer networks. We designed the constituents and compositions to exhibit desired thermomechanical behavior (including rubbery modulus, glass transition temperature and failure strain which is more than 300% and larger than any existing printable materials) to enable controlled shape memory behavior. We used a high resolution, high contrast digital micro display to ensure high resolution of photo-curing methacrylate based SMPs that requires higher exposure energy than more common acrylate based polymers. An automated material exchange process enables the manufacture of 3D composite architectures from multiple photo-curable SMPs. In order to understand the behavior of the 3D composite microarchitectures, we carry out high fidelity computational simulations of their complex nonlinear, time-dependent behavior and study important design considerations including local deformation, shape fixity and free recovery rate. Simulations are in good agreement with experiments for a series of single and multimaterial components and can be used to facilitate the design of SMP 3D structures.
引用
收藏
页数:11
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