Micro/nano patterning characteristics in hot embossing process

被引:0
|
作者
Kim, HY [1 ]
Kim, KS [1 ]
Kim, BH [1 ]
机构
[1] Kangwon Natl Univ, Div Mech Engn & Mechatron, Chunchon, South Korea
关键词
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The hot embossing process has been known as one of major nano replication techniques. This is due to its simple process, low cost, high replication fidelity and relatively high throughput. As the initial step of quantitating the hot embossing process, simple parametric studies for the embossing time have been carried out using high-resolution masters which patterned by DRIE process and laser machining. Under different embossing times, the viscous flow of thin PMMA films into micro cavities under the compression force has been investigated. Also, the viscous flow during the embossing process was simulated by the continuum based FDM analysis considering micro/nano effect, such as surface tension and contact angle.
引用
收藏
页码:1470 / 1475
页数:6
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