Warpage reduction with variable pressure profile in plastic injection molding via sequential approximate optimization

被引:48
|
作者
Kitayama, Satoshi [1 ]
Onuki, Ryosuke [2 ]
Yamazaki, Koetsu [1 ]
机构
[1] Kanazawa Univ, Kanazawa, Ishikawa 9201192, Japan
[2] Kanazawa Univ, Grad Sch Nat Sci Technol, Kanazawa, Ishikawa 9201192, Japan
关键词
Plastic injection molding; Warpage reduction; Variable pressure profile; Short shot; Sequential approximate optimization; Radial basis function network; NEURAL-NETWORK MODEL; MOLDED PART; PROCESS PARAMETERS; SHRINKAGE;
D O I
10.1007/s00170-014-5697-7
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
Warpage reduction is one of the important issues in plastic injection molding (PIM). In order to resolve this issue, there are mainly two ways to reduce warpage: One is to design the mold, and the other is to optimize the process parameters such as the mold temperature, the melt temperature, and so on. In this paper, the latter approach is employed. In particular, variable pressure profile approach is adopted for the warpage reduction. Besides the variable pressure profile, the melt temperature and the mold temperature are taken as the design variables. Also, short shot that the melt plastic is not filled into the cavity is one of the fatal defects in PIM. Unlike the literature, in this paper, the short shot is handled as the design constraint. PIM simulation is generally so costly and time consuming, and then the surrogate-based optimization technique is used. The radial basis function (RBF) network is used throughout sequential approximate optimization (SAO) procedure. Moldex3D is used for PIM simulation. In order to compare the effectiveness of the variable pressure profile, the traditional process parameter optimization considered in the literature is also carried out. Numerical results show that the variable pressure profile is one of the effective ways to warpage reduction compared to the traditional process parameter optimization.
引用
收藏
页码:827 / 838
页数:12
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