AN INVESTIGATION ON THE PROFILE OF MICROLENS BY THE THERMAL REFLOW PROCESS DUE TO SURFACE TENSION AND GRAVITY

被引:0
|
作者
Tsai, Jhy-Cherng [1 ]
Hsu, Yong-Sung [1 ]
机构
[1] Natl Chung Hsing Univ, Dept Mech Engn, Taichung 40227, Taiwan
关键词
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Microlens and its mold fabricated by thermal reflow using photoresist have been widely used for forming patterns in different scales. When the photoresist solidifies from melting condition, for example by the reflow process, its profile is formed based oil the balance between surface tension and gravity. This research is aimed to investigate the influence of Surface tension and gravity oil the profile of microlens in thermal reflow process. Theoretical analysis based on the interaction between surface tension and gravity of liquid droplet is first investigated. The result showed that the height to diameter ratio (h/D), or the sag ratio, of the liquid droplet is affected by the Bond number (Bo), a number defined as the ratio of gravity to surface tension. The sag ratio is not sensitive to Bo when Bo is small but the ratio decreases as Bo increases if Bo is over the critical number. Based on the analysis, the critical number for the AZ4620 photoresist on a silicon substrate is 1, corresponding to the critical radius of droplet R=2,500 mu m. When the size of the droplet is less then the critical size, the profile is mainly controlled by the surface tension and thus the sag ratio is about the same regardless the size. The profile, in contrast, is highly affected by the gravity if the size of the droplet is larger then the critical size. The sag ratio decreases exponentially with respect to Bo in this case. Experiments are also designed and conducted to verify the analysis. Experimental result showed that the sag ratio of the photoresist reduces to 0.065 from 0.095 when Bo increases from 0.0048 to 0.192. The results showed that the trend is consistent to the theoretical model.
引用
收藏
页码:569 / 572
页数:4
相关论文
共 50 条
  • [21] Large-area fabrication of microlens arrays by using self-pinning effects during the thermal reflow process
    Heo, S. G.
    Jang, D.
    Koo, H. -J.
    Yoon, H.
    OPTICS EXPRESS, 2019, 27 (03): : 3439 - 3447
  • [22] STREAMING DUE TO A THERMAL SURFACE-TENSION GRADIENT - SUMMARY
    ANDERSSON, D
    JOURNAL OF COLLOID AND INTERFACE SCIENCE, 1976, 56 (01) : 184 - 185
  • [23] Stretchability enhancement of electronics according to the surface patterns fabricated by thermal reflow process
    Lee, Ho Jin
    Seo, Min-Won
    Yi, Jungho
    Seo, Jong Mo
    2019 41ST ANNUAL INTERNATIONAL CONFERENCE OF THE IEEE ENGINEERING IN MEDICINE AND BIOLOGY SOCIETY (EMBC), 2019, : 1282 - 1285
  • [24] A new fabrication method for an asymmetric microlens array light control film using inclined exposure and an incomplete thermal reflow process
    Lin, Tsung-Hung
    Hung, Shih-Yu
    Hung, Chien-Hsin
    Shen, Ming-Ho
    Chao, Ching-Kong
    Yang, Hsiharng
    JOURNAL OF THE CHINESE INSTITUTE OF ENGINEERS, 2015, 38 (01) : 85 - 92
  • [25] Investigation of hygrothermally induced failures in multilayer ceramic capacitors during thermal reflow process
    Apalowo, Rilwan Kayode
    Abas, Aizat
    Bachok, Zuraihana
    Sharif, Mohamad Fikri Mohd
    Ani, Fakhrozi Che
    Ramli, Mohamad Riduwan
    Mukhtar, Muhamed Abdul Fatah bin Muhamed
    MICROELECTRONICS RELIABILITY, 2023, 146
  • [26] Numerical Study on the Effects of Gravity and Surface Tension on Condensation Process in Square Minichannel
    Panpan Li
    Zhenqian Chen
    Juan Shi
    Microgravity Science and Technology, 2018, 30 : 19 - 24
  • [27] Numerical Study on the Effects of Gravity and Surface Tension on Condensation Process in Square Minichannel
    Li, Panpan
    Chen, Zhenqian
    Shi, Juan
    MICROGRAVITY SCIENCE AND TECHNOLOGY, 2018, 30 (1-2) : 19 - 24
  • [28] Surface tension/thermal mismatch in a self-assembly process
    Chao, R. M.
    Hsu, C. C.
    Chu, F. I.
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2008, 18 (11)
  • [29] Multiphysics to Investigate the Thermal and Mechanical Responses in Hard Disk Drive Components Due to the Reflow Soldering Process
    Kimaporn, Napatsorn
    Samakkarn, Chawit
    Thongsri, Jatuporn
    PROCESSES, 2024, 12 (09)
  • [30] Investigation of the influence of gravity waves on the surface thermal signatures and buoyant trajectory of thermal wakes
    Wang, Min
    Lai, Qingzhi
    Xie, Yinmo
    Tan, Jianyu
    OCEAN ENGINEERING, 2023, 287