A HIGH-SPEED OPTICAL MULTIDROP BUS FOR COMPUTER INTERCONNECTIONS

被引:8
|
作者
Tan, Michael R. T. [1 ]
Rosenberg, Paul
Yeo, Jong-Souk
McLaren, Moray [2 ]
Mathai, Sagi [1 ]
Morris, Terry
Kuo, Huei Pei [1 ]
Straznicky, Joseph [1 ]
Jouppi, Norman P.
Wang, Shih-Yuan
机构
[1] Hewlett Packard Labs, Informat & Quantum Syst Lab, Palo Alto, CA 94304 USA
[2] Hewlett Packard Labs, Exascale Comp Lab, Palo Alto, CA 94304 USA
关键词
POLARIZATION;
D O I
10.1109/MM.2009.57
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
SIGNAL INTEGRITY CONSTRAINTS OF HIGH-SPEED ELECTRONICS HAVE MADE MULTIDROP ELECTRICAL BUSES INFEASIBLE. THIS HIGH-SPEED ALTERNATIVE USES HOLLOW METAL WAVEGUIDES AND PELLICLE BEAM SPUTTERS THAT INTERCONNECT MODULES ATTACHED TO THE BUS. WITH I MW OF LASER POWER, THE BUS CAN INTERCONNECT EIGHT MODULES AT 10 GBPS PER CHANNEL AND ACHIEVES AN AGGREGATE BANDWIDTH OF MORE THAN 25 GBYTES PER SECOND WITH 10-BIT-WIDE SIGNALING PATHS.
引用
收藏
页码:62 / 73
页数:12
相关论文
共 50 条
  • [1] A high-speed optical multi-drop bus for computer interconnections
    Tan, Michael
    Rosenberg, Paul
    Yeo, Jong Souk
    McLaren, Moray
    Mathai, Sagi
    Morris, Terry
    Kuo, Huei Pei
    Straznicky, Joseph
    Jouppi, Norman P.
    Wang, Shih-Yuan
    [J]. APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2009, 95 (04): : 945 - 953
  • [2] A high-speed optical multi-drop bus for computer interconnections
    Tan, Michael
    Rosenberg, Paul
    Yeo, Jong Souk
    McLaren, Moray
    Mathai, Sagi
    Morris, Terry
    Straznicky, Joseph
    Jouppi, Norman P.
    Kuo, Huei Pei
    Wang, Shih-Yuan
    Lemer, Scott
    Kornilovich, Pavel
    Meyer, Neal
    Bicknell, Robert
    Otis, Charles
    Seals, Len
    [J]. 16TH ANNUAL IEEE SYMPOSIUM ON HIGH-PERFORMANCE INTERCONNECTS, PROCEEDINGS, 2008, : 3 - 10
  • [3] A high-speed optical multi-drop bus for computer interconnections
    Michael Tan
    Paul Rosenberg
    Jong Souk Yeo
    Moray McLaren
    Sagi Mathai
    Terry Morris
    Huei Pei Kuo
    Joseph Straznicky
    Norman P. Jouppi
    Shih-Yuan Wang
    [J]. Applied Physics A, 2009, 95 : 945 - 953
  • [4] An alignment insensitive separable electromagnetic coupler for high-speed digital multidrop bus applications
    Benham, JR
    Amirtharajah, R
    Critchlow, JL
    Simon, T
    Knight, TE
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2003, 51 (12) : 2597 - 2603
  • [5] High-speed optical backboard bus
    Yamaguchi, S
    Itoh, K
    Ohno, Y
    Shimoda, Y
    Hayashi, T
    Ashida, T
    Mikazuki, T
    [J]. IEICE TRANSACTIONS ON ELECTRONICS, 2002, E85C (02) : 384 - 390
  • [6] COMPUTER-AIDED ANALYSIS OF HIGH-SPEED PACKAGING INTERCONNECTIONS
    PALUSINSKI, OA
    LIAO, JC
    PRINCE, JL
    CANGELLARIS, AC
    [J]. PROCEEDINGS OF THE TECHNICAL CONFERENCE : EIGHTH ANNUAL INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE, 1988, : 601 - 605
  • [7] 1.1μm range InGaAsVCSELs for high-speed optical interconnections
    Suzuki, N
    Hatakeyama, H
    Tokutome, K
    Yamada, M
    Anan, T
    Tsuji, M
    [J]. 2005 IEEE LEOS Annual Meeting Conference Proceedings (LEOS), 2005, : 393 - 394
  • [8] Characterisation of high-speed multiconductor interconnections
    Znamirowski, L
    Palusinski, OA
    [J]. IEE PROCEEDINGS-SCIENCE MEASUREMENT AND TECHNOLOGY, 2002, 149 (02) : 85 - 91
  • [9] Design Of High-speed Decoder For New High-Speed Bus
    Zhang Weigong
    Yang Bo
    Ding Rui
    Hu Yongqin
    [J]. INFORMATION TECHNOLOGY FOR MANUFACTURING SYSTEMS, PTS 1 AND 2, 2010, : 958 - 962
  • [10] HIGH-SPEED BUS INTERFACES
    QUINNELL, RA
    [J]. EDN, 1993, 38 (20) : 43 - &