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- [5] Outgassing of Materials Used for Thin Film Vacuum Packages 2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, : 722 - +
- [7] Thin film epitaxy on Si for microelectronics ADVANCED MICROELECTRONIC PROCESSING TECHNIQUES, 2000, 4227 : 1 - 8
- [9] FRONTIERS IN MICROELECTRONICS AND THIN-FILM COMPONENTS JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1980, 17 (01): : 1 - 8
- [10] THIN FILM DEPOSITION TECHNIQUES IN MICROELECTRONICS. Journal of Metals, 1986, 38 (02): : 55 - 65