Analytical Extraction of Via-Via Inductance by Using SMM for Power-Ground Planes

被引：0
|
作者：
Luo, Guang-Xiao [1 ]
Wei, Xing-Chang [2 ]
Cui, Xiang [1 ]
Li, Er-Ping [2 ]
机构：
[1] North China Elect Power Univ, Beijing 102206, Peoples R China
[2] Zhejiang Univ, Hangzhou 310027, Zhejiang, Peoples R China
来源：
2011 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS) | 2011年
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D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, the via-via inductance between power-ground plane in printed circuit board is extracted analytically by using the scattering matrix method(SMM). A gap voltage source is used to excited the higher order modes between parallel plates, by solving the linear scattering matrix equation, the scattered wave coefficient is obtained, furthermore, the admittance parameter between two vias is calculated, and the analytical inductance formula with frequency dependence is obtained and validated by quasi-static numerical method.
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页数：4
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