DEVELOPMENT OF CRYOGENIC POWER MODULES FOR SUPERCONDUCTING HYBRID POWER ELECTRONIC SYSTEM

被引：0
|
作者：
Ye, Hua [1 ]
Haldar, Pradeep [1 ]
机构：
[1] Microsoft Corp, Redmond, WA 98052 USA
来源：
IMECE2008: PROCEEDINGS OF THE INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION - 2008, VOL 6 | 2009年
关键词：
D O I：
暂无
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
This paper presents the development; of high-performance integrated cryogenic power modules, where both driver components and power MOSFETs are integrated in a single package. These modules are designed to be used in liquid nitrogen environment with extreme thermal cycling for the cryogenic power inverters. Compact high-voltage, cryogenic integrated power modules with single power MOSFET that exhibited more than 14x improvement in on-resistance and continuous current-carrying capability exceeding 40A. A multi-power MOSFETs integrated cryogenic power module is then developed in order to further increase the power density and reduce the size and weight of the cryogenic power system. The multi-power MOSFETs module was demonstrated to be able to carry a current above 100A with only a small increase in footprint compared with the single power MOSFET module. At the current level of 100A, the multi-power MOSFETs module has an on-resistance of 5.5mU at 77K, which is 6 times smaller than that of the single power MOSFET integrated module developed. Two different design approaches taken in the developments of these modules are discussed in this paper.
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页码：109 / 114
页数：6
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