On Development of a Novel Control Scheme for a Thermal Simulation Device

被引：0

作者：

Lu, Qi ^{[1
]}

Gu, Hao ^{[1
]}

Qi, Liwei ^{[1
]}

Li, Yunze ^{[2
]}

机构：

[1] ABB China Ltd, ABB Corp Res Ctr China, Shanghai, Peoples R China

[2] Beihang Univ, Sch Automat Sci & Engn, Beijing, Peoples R China

来源：

2013 INTERNATIONAL CONFERENCE ON ADVANCED MECHATRONIC SYSTEMS (ICAMECHS) | 2013年

关键词：

thermal control; thermal simulation; thermoelectric cooler; THERMOELECTRIC COOLER;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A novel control scheme was proposed in this paper for a thermal simulation device (TSD) to dynamically modify its thermal properties. Rather than controlling either the temperature or heat flow of the device, the proposed control scheme regulates the relation between the temperature and the heat flow in a dynamic fashion. As a result, the controlled TSD will be capable of simulating the thermal behavior of a generic mechanical system in terms of the thermal effects on the heat source. The feasibility of this idea was examined by a simulation study as well as a hardware-in-the-loop experimental study.

引用

页码：274 / 279

页数：6

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