Critical evaluation of hard-breakdown based reliability methodologies for ultrathin gate oxides

被引:3
|
作者
Lai, W
Wu, E
Suñé, J
机构
[1] Univ Autonoma Barcelona, Dept Elect Engn, E-08193 Bellaterra, Spain
[2] IBM Microelect, Essex Jct, VT USA
关键词
MOS devices; dielectric breakdown; gate oxide reliability;
D O I
10.1016/j.mee.2003.12.009
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Reliability methodologies based on the tolerance of CMOS devices and circuits to breakdown events are examined. It is shown that the prevalence ratio model (devices tolerate soft breakdown and fail with hard breakdown) and the successive breakdown description of the statistics are consistent with one another. The definition of breakdown of ultrathin oxides and possible problems for the experimental measure of the hard breakdown prevalence ratio are discussed. Finally, it is shown that hard breakdown occurs in ultra-thin oxides under stress voltages much lower than previously anticipated. (C) 2004 Elsevier B.V. All rights reserved.
引用
收藏
页码:16 / 23
页数:8
相关论文
共 50 条
  • [21] Thickness evaluation of ultrathin gate oxides at the limit
    Moon, DW
    Kim, HK
    Lee, HJ
    Cho, YJ
    Cho, HM
    CHARACTERIZATION AND METROLOGY FOR ULSI TECHNOLOGY, 1998, 449 : 197 - 200
  • [22] Extended Arrhenius law of time-to-breakdown of ultrathin gate oxides
    Xu, MZ
    Tan, CH
    Li, MF
    APPLIED PHYSICS LETTERS, 2003, 82 (15) : 2482 - 2484
  • [23] Experimental evidence for voltage driven breakdown models in ultrathin gate oxides
    Nicollian, Paul E.
    Hunter, William R.
    Hu, Jerry C.
    Annual Proceedings - Reliability Physics (Symposium), 2000, : 7 - 15
  • [24] Effect of growth conditions on the reliability of ultrathin MOS gate oxides
    Yang, TC
    Saraswat, KC
    MATERIALS RELIABILITY IN MICROELECTRONICS VI, 1996, 428 : 355 - 360
  • [25] A common framework for soft and hard breakdown in ultrathin oxides based on the theory of point contact conduction
    Miranda, E
    Suñé, J
    Rodríguez, R
    Nafría, M
    Aymerich, X
    MICROELECTRONIC ENGINEERING, 1999, 48 (1-4) : 171 - 174
  • [26] Common framework for soft and hard breakdown in ultrathin oxides based on the theory of point contact conduction
    Miranda, E.
    Suñé, J.
    Rodríguez, R.
    Nafría, M.
    Aymerich, X.
    Microelectronic Engineering, 1999, 48 (01): : 171 - 174
  • [27] Breakdown and anti-breakdown events in high-field stressed ultrathin gate oxides
    Miranda, E
    Suné, J
    Rodríguez, R
    Nafría, M
    Aymerich, X
    SOLID-STATE ELECTRONICS, 2001, 45 (08) : 1327 - 1332
  • [28] Dielectric breakdown induced epitaxy in ultrathin gate oxide - A reliability concern
    Pey, KL
    Tung, CH
    Radhakrishnan, MK
    Tang, LJ
    Lin, WH
    INTERNATIONAL ELECTRON DEVICES 2002 MEETING, TECHNICAL DIGEST, 2002, : 163 - 166
  • [29] Evaluation of plasma charging damage in ultrathin gate oxides
    Lin, HC
    Chen, CC
    Chien, CH
    Hsein, SK
    Wang, MF
    Chao, TS
    Huang, TY
    Chang, CY
    IEEE ELECTRON DEVICE LETTERS, 1998, 19 (03) : 68 - 70
  • [30] Dependence of reliability of ultrathin MOS gate oxides on the Fermi level positions at gate and substrate
    Yang, TC
    Bhat, N
    Saraswat, KC
    MATERIALS RELIABILITY IN MICROELECTRONICS VII, 1997, 473 : 123 - 128