Critical evaluation of hard-breakdown based reliability methodologies for ultrathin gate oxides

被引:3
|
作者
Lai, W
Wu, E
Suñé, J
机构
[1] Univ Autonoma Barcelona, Dept Elect Engn, E-08193 Bellaterra, Spain
[2] IBM Microelect, Essex Jct, VT USA
关键词
MOS devices; dielectric breakdown; gate oxide reliability;
D O I
10.1016/j.mee.2003.12.009
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Reliability methodologies based on the tolerance of CMOS devices and circuits to breakdown events are examined. It is shown that the prevalence ratio model (devices tolerate soft breakdown and fail with hard breakdown) and the successive breakdown description of the statistics are consistent with one another. The definition of breakdown of ultrathin oxides and possible problems for the experimental measure of the hard breakdown prevalence ratio are discussed. Finally, it is shown that hard breakdown occurs in ultra-thin oxides under stress voltages much lower than previously anticipated. (C) 2004 Elsevier B.V. All rights reserved.
引用
收藏
页码:16 / 23
页数:8
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