In-process roughness measurement on moving surfaces

被引：33
|
作者：
Wong, PL [1 ]
Li, KY [1 ]
机构：
[1] City Univ Hong Kong, Mfg Engn & Engn Management Dept, Kowloon, Hong Kong, Peoples R China
来源：
OPTICS AND LASER TECHNOLOGY | 1999年 / 31卷 / 08期
关键词：
in-process measurement; surface roughness; topography;
D O I：
10.1016/S0030-3992(99)00108-5
中图分类号：
O43 [光学];
学科分类号：
070207 ; 0803 ;
摘要：
A new optical technique, which utilises the combined effects of interference and light scattering, was developed for surface roughness measurements. This paper presents the technique applicable to extracting the roughness of moving surfaces under high rotational speeds up to 3.7 m/s. The applicability of the technique to in-process roughness measurement was demonstrated with a cylindrical grinding process. (C) 2000 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码：543 / 548
页数：6
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