Thermal Strain Measurement Using Digital Image Correlation with Systematic Error Elimination

被引：0

作者：

Murata, Manabu ^{[1
]}

Arikawa, Shuichi ^{[2
]}

Yoneyama, Satoru ^{[1
]}

Fujimoto, Yasuhisa ^{[3
]}

Omoto, Yohei ^{[3
]}

机构：

[1] Aoyama Gakuin Univ, Dept Mech Engn, Chuo Ku, 5-10-1 Fuchinobe, Sagamihara, Kanagawa 2525258, Japan

[2] Meiji Univ, Dept Mech Engn Informat, Tama Ku, 1-1-1 Higashimita, Kawasaki, Kanagawa 2140031, Japan

[3] Mitsubishi Electr Corp, Adv Technol Res & Dev Ctr, 8-1-1 Tsukaguchi Honmachi, Amagasaki, Hyogo 6618661, Japan

来源：

ADVANCEMENT OF OPTICAL METHODS IN EXPERIMENTAL MECHANICS, VOL 3 | 2017年

关键词：

DIC; Electronic packing; Thermal strain; High magnification; Systematic error elimination;

D O I：

10.1007/978-3-319-41600-7_8

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

This research aims to develop a method for measuring small strains at minute area on an electronic packaging using digital image correlation. To this end, the systematic error in the measured displacement is corrected by using the relation between measured displacement and actual displacement. This relation is obtained by measuring rigid rotation and in-plane translation. The strain distribution with high spatial resolution can be obtained from the displacement distribution because the systematic error that affects the resolution of the strain is eliminated. This error elimination method is applied to the thermal strain measurement of a bimaterial which is composed of copper and steel. Results show that high spatial resolution strain distributions at minute area can be obtained by using this method.

引用

页码：71 / 76

页数：6

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