Improvement of Ni nonalloyed ohmic contacts on p-GaN films by changing thickness of p-InGaN capping layers

被引:5
|
作者
Chu, Yow-Lin [1 ]
Lin, Yow-Jon
Ho, Cheng-Hsiang
Chen, Wei-Li
机构
[1] Natl Changhua Univ Educ, Inst Photon, Gifu 500, Taiwan
[2] Natl Changhua Univ Educ, Dept Elect Engn, Gifu 500, Taiwan
关键词
gaN; InGaN; ohmic contact; two-dimensional hole gas; specific contact resistance;
D O I
10.1143/JJAP.45.6884
中图分类号
O59 [应用物理学];
学科分类号
摘要
The influence of the thickness of p-type InGaN (p-InGaN) capping layers grown on p-type GaN (p-GaN) on the electrical properties of Ni contacts on p-GaN was investigated in this study. Experiments and simulations indicated that a thicker p-InGaN capping layer grown on p-GaN led to the formation of a higher concentration of a two-dimensional hole gas (2DHG) at the interfaces. In addition, owing to a low barrier at the interfaces, holes can be easily injected into the p-GaN layer through recessed channels and a 2DHG channel, resulting in the formation of nonalloyed ohmic contacts with a low specific contact resistance of 1.7 x 10(-5) Omega cm(2).
引用
收藏
页码:6884 / 6887
页数:4
相关论文
共 50 条
  • [21] Formation of epitaxial Au/Ni/Au ohmic contacts to p-GaN
    Narayan, J
    Wang, H
    Oh, TH
    Choi, HK
    Fan, JCC
    [J]. APPLIED PHYSICS LETTERS, 2002, 81 (21) : 3978 - 3980
  • [22] Electrical and optical characteritics of Au/Ni ohmic contacts to p-GaN
    Chang, YS
    Huang, TS
    Nee, CY
    [J]. PROCEEDINGS OF THE SIXTH CHINESE OPTOELECTRONICS SYMPOSIUM, 2003, : 107 - 107
  • [23] Ohmic contacts to n- and p-GAN
    Lester, LF
    King, DJ
    Zhang, L
    Ramer, JC
    Hersee, SD
    Zolper, JC
    [J]. PROCEEDINGS OF THE TWENTY-SIXTH STATE-OF-THE-ART PROGRAM ON COMPOUND SEMICONDUCTORS (SOTAPOCS XXVI), 1997, 97 (01): : 170 - 177
  • [24] Nonalloyed ohmic formation for p-type AlGaN with p-type GaN capping layers using ohmic recessed technique
    Lin, YJ
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 2006, 45 (1-3): : L86 - L88
  • [25] IMPROVING THE OHMIC PROPERTIES OF Au/Ni-Mg/p-GaN CONTACTS BY ADDING SWCNT METALLIZATION INTERLAYER BETWEEN METAL AND p-GaN LAYERS
    Liday, Jozef
    Vogrincic, Peter
    Vretenar, Viliam
    Hotovy, Ivan
    Kotlar, Mario
    Marton, Marian
    Rehacek, Vlastimil
    [J]. JOURNAL OF ELECTRICAL ENGINEERING-ELEKTROTECHNICKY CASOPIS, 2013, 64 (06): : 390 - 392
  • [26] Research of the ohmic contact between p-InGaN and Ni/Au
    Optoelectronic Technology Laboratory, Beijing University of Technology, Beijing 100022, China
    [J]. Guti Dianzixue Yanjiu Yu Jinzhan, 2008, 1 (87-90):
  • [27] Degradation Mechanism of Pd/p-GaN Ohmic Contacts
    Pd/p-GaN欧姆接触退化机理
    [J]. Wang, Rong-Xin (rxwang2008@sinano.ac.cn); Yang, Hui (hyang2006@sinano.ac.cn), 1600, Editorial Office of Chinese Optics (42): : 1065 - 1073
  • [28] A new method of making ohmic contacts to p-GaN
    Hernandez-Gutierrez, C. A.
    Kudriavtsev, Yu.
    Mota, Esteban
    Hernandez, A. G.
    Escobosa-Echavarria, A.
    Sanchez-Resendiz, V.
    Casallas-Moreno, Y. L.
    Lopez-Lopez, M.
    [J]. NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 2016, 388 : 35 - 40
  • [29] High temperature instabilities of ohmic contacts on p-GaN
    Trevisanello, Lorenzo
    Meneghini, Matteo
    Zehnder, Ulrich
    Hahn, Berthold
    Meneghesso, Gaudenzio
    Zanoni, Enrico
    [J]. PHYSICA STATUS SOLIDI C - CURRENT TOPICS IN SOLID STATE PHYSICS, VOL 5, NO 2 2008, 2008, 5 (02): : 435 - +
  • [30] Effects of Ni cladding layers on suppression of Ag agglomeration in Ag-based Ohmic contacts on p-GaN
    Son, Jun Ho
    Song, Yang Hee
    Yu, Hak Ki
    Lee, Jong-Lam
    [J]. APPLIED PHYSICS LETTERS, 2009, 95 (06)