Plasma combined self-assembled monolayer pretreatment on electroplated-Cu surface for low temperature Cu-Sn bonding in 3D integration

被引：10

作者：

Wang, Junqiang ^{[1
,2
]}

Wang, Qian ^{[2
]}

Wu, Zijian ^{[2
]}

Tan, Lin ^{[2
]}

Cai, Jian ^{[2
,3
]}

Wang, Dejun ^{[1
]}

机构：

[1] Dalian Univ Technol, Sch Elect Sci & Technol, Dalian 116024, Peoples R China

[2] Tsinghua Univ, Inst Microelect, Beijing 100084, Peoples R China

[3] Tsinghua Univ, Tsinghua Natl Lab Informat Sci & Technol, Beijing 100084, Peoples R China

来源：

APPLIED SURFACE SCIENCE | 2017年 / 403卷

关键词：

3D integration; low temperature Cu-Sn bonding; Plasma pretreatment; Self-assembled monolayer (SAM); INTERMETALLIC COMPOUNDS; KEY TECHNOLOGIES; PASSIVATION; ALKANETHIOLS; ADSORPTION; GROWTH;

D O I：

10.1016/j.apsusc.2017.01.207

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

A novel pretreatment of plasma combined self-assembled monolayer (PcSAM) was proposed to improve surface properties of electroplated Cu for low temperature Cu-Sn bonding in 3D integration. Measurement results revealed that self-assemble monolayer (SAM) would be easier absorbed on plasma-activated Cu surface and protect the clean surface from re-oxidation when storage. The absorbed SAM layer could be removed by thermal desorption during bonding process. With optimal PcSAM pretreatment, oxygen content of the Cu surface was reduced to as low as 1.39%. The followed Cu-Sn bonding was realized at low temperature of 200 degrees C. Finally, bonding interface exhibited a defect-free interconnection, and bonding strength has reached as high as 68.7 MPa. (C) 2017 Elsevier B.V. All rights reserved.

引用

页码：525 / 530

页数：6

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