Meeting manufacturing metrology challenges at 90 nm and beyond

被引：0
|
作者：
Bunday, Benjamin [1 ]
Godwin, Milton [1 ]
Lipscomb, Pete [1 ]
Patel, Dilip [1 ]
Bishop, Michael [1 ]
Allgair, John [1 ]
Diebold, Alain C. [1 ]
机构：
[1] SEMATECH, ISMI, Austin, TX 78741 USA
来源：
MICRO | 2005年 / 23卷 / 07期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：31 / 41
页数：11
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