Measurement of stress gradients in hydrogenated microcrystalline silicon thin films using Raman spectroscopy

被引:15
|
作者
Paillard, V
Puech, P
Cabarrocas, PRI
机构
[1] Univ Toulouse 3, CNRS, UMR 5477, Phys Solides Lab, F-31062 Toulouse 4, France
[2] Ecole Polytech, CNRS, UMR 7647, Phys Interfaces & Couches Minces Lab, F-91128 Palaiseau, France
关键词
D O I
10.1016/S0022-3093(02)00936-5
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Raman spectroscopy is a powerful tool to measure stress in semiconductors. We show both large stress values and stress gradients in hydrogenated microcrystalline silicon thin films, by the use of different excitation wavelengths, from red to near-ultraviolet, allowing us to probe different film depths. For films deposited by standard radio frequency glow discharge at different substrate temperatures. we find that stress evolves from highly compressive in the bulk of the film, close to the glass substrate. to tensile near the film free surface. Moreover, the higher the substrate temperature, the higher the stress gradient. (C) 2002 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:280 / 283
页数:4
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