Fatigue Properties of Lead-free Doped Solder Joints

被引：0
|
作者：
Su, Sinan [1 ]
Akkara, Francy John [1 ]
Abueed, Mohammed [1 ]
Jian, Minghong [1 ]
Hamasha, Sa'd [1 ]
Suhling, Jeff [2 ]
Lall, Pradeep [2 ]
机构：
[1] Auburn Univ, Dept Ind & Syst Engn, Auburn, AL 36849 USA
[2] Auburn Univ, Dept Mech Engn, Auburn, AL 36849 USA
来源：
PROCEEDINGS OF THE 17TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2018) | 2018年
关键词：
Solder joint; Fatigue; Reliability; Doped solder; STRENGTH; SHEAR; RELIABILITY;
D O I：
暂无
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
The reliability of an electronic assembly is limited by a fatigue failure of one of the interconnected solder joints. Fatigue properties of the common lead free solder joints have been studied for large bulk solder samples. However, the microstructure of actual size solder joints is completely different than the large solder samples, which can lead to different mechanical and fatigue properties. SnAgCu (SAC) based solder alloys are widely used in the electronic industry recently. To further enhance the reliability of solder alloys, SAC alloys with small amounts of additives such as Ni, Bi, Sb was developed. In this paper, the mechanical properties of individual doped SAC solder joints are studied. The experiment includes shear test and shear fatigue cycling test of individual doped SAC based solder spheres and the common SAC305 solder spheres with three surface finishes including OSP, ImAg, and ENIG on cupper pads. The effect of surface finish and shear strain rate on the shear strength was studied, and the effect of stress amplitude on fatigue life was analyzed as well. The results showed that solder joints with high Ag have superior fatigue properties. ImAg surface finish was demonstrated as a better surface finish in terms of shear strength.
引用
收藏
页码：1243 / 1248
页数：6
相关论文
共 50 条
  • [31] Accelerated thermal fatigue of lead-free solder joints as a function of reflow cooling rate
    Qi, Y
    Zbrzezny, AR
    Agia, M
    Lam, R
    Ghorbani, HR
    Snugovsky, P
    Perovic, DD
    Spelt, JK
    JOURNAL OF ELECTRONIC MATERIALS, 2004, 33 (12) : 1497 - 1506
  • [32] Accelerated thermal fatigue of lead-free solder joints as a function of reflow cooling rate
    Y. Qi
    A. R. Zbrzezny
    M. Agia
    R. Lam
    H. R. Ghorbani
    P. Snugovsky
    D. D. Perovic
    J. K. Spelt
    Journal of Electronic Materials, 2004, 33 : 1497 - 1506
  • [33] Research on low cycle fatigue behavior of BGA structure lead-free solder joints
    Qin, Hongbo
    Li, Wangyun
    Li, Xunping
    Zhang, Xinping
    Jixie Gongcheng Xuebao/Journal of Mechanical Engineering, 2014, 50 (20): : 54 - 62
  • [34] Accelerated fatigue test methods of lead-free solder joints in surface mounting technology
    Zdzislaw, D
    Jaroslaw, B
    Jaroslaw, D
    Marcin, S
    27TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY, BOOKS 1-3, CONFERENCE PROCEEDINGS: MEETING THE CHALLENGES OF ELECTRONICS TECHNOLOGY PROGRESS, 2004, : 99 - 104
  • [35] Fatigue Behaviour of Lead-Free Solder Joints Under Combined Thermal and Vibration Loads
    Meier, Karsten
    Winkler, Maria
    Bock, Karlheinz
    Leslie, David
    Dasgupta, Abhijit
    2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2019, : 498 - 504
  • [36] Fatigue performance and microstructure of lead-free solder joints in BGA assembly at room temperature
    Wei, Xin
    Hamasha, Sa'd
    Alahmer, Ali
    Belhadi, Mohamed El Amine
    Vyas, Palash Pranav
    MICROELECTRONICS RELIABILITY, 2023, 149
  • [37] Comparison of isothermal mechanical fatigue properities of lead-free solder joints and bulk solders
    Andersson, C
    Lai, ZH
    Liu, JH
    Jiang, HR
    Yu, YN
    FIFTH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, PROCEEDINGS, 2003, : 371 - 376
  • [38] Effect of thermomechanical fatigue on drop impact properties of Sn-Ag-Cu Lead-Free Solder Joints
    Kobayashi, Takayuki
    Terashima, Shinichi
    Tanaka, Masamoto
    PROCEEDINGS OF THE 2012 IEEE 14TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2012, : 215 - 218
  • [39] Size and constraining effects in lead-free solder joints
    Cugnoni, J
    Botsis, J
    Janczak-Rusch, J
    ADVANCED ENGINEERING MATERIALS, 2006, 8 (03) : 184 - 191
  • [40] EVALUATION OF LEAD-FREE SOLDER JOINTS IN ELECTRONIC ASSEMBLIES
    ARTAKI, I
    JACKSON, AM
    VIANCO, PT
    JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (08) : 757 - 764
12345