Fatigue Properties of Lead-free Doped Solder Joints

被引：0
|
作者：
Su, Sinan [1 ]
Akkara, Francy John [1 ]
Abueed, Mohammed [1 ]
Jian, Minghong [1 ]
Hamasha, Sa'd [1 ]
Suhling, Jeff [2 ]
Lall, Pradeep [2 ]
机构：
[1] Auburn Univ, Dept Ind & Syst Engn, Auburn, AL 36849 USA
[2] Auburn Univ, Dept Mech Engn, Auburn, AL 36849 USA
来源：
PROCEEDINGS OF THE 17TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2018) | 2018年
关键词：
Solder joint; Fatigue; Reliability; Doped solder; STRENGTH; SHEAR; RELIABILITY;
D O I：
暂无
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
The reliability of an electronic assembly is limited by a fatigue failure of one of the interconnected solder joints. Fatigue properties of the common lead free solder joints have been studied for large bulk solder samples. However, the microstructure of actual size solder joints is completely different than the large solder samples, which can lead to different mechanical and fatigue properties. SnAgCu (SAC) based solder alloys are widely used in the electronic industry recently. To further enhance the reliability of solder alloys, SAC alloys with small amounts of additives such as Ni, Bi, Sb was developed. In this paper, the mechanical properties of individual doped SAC solder joints are studied. The experiment includes shear test and shear fatigue cycling test of individual doped SAC based solder spheres and the common SAC305 solder spheres with three surface finishes including OSP, ImAg, and ENIG on cupper pads. The effect of surface finish and shear strain rate on the shear strength was studied, and the effect of stress amplitude on fatigue life was analyzed as well. The results showed that solder joints with high Ag have superior fatigue properties. ImAg surface finish was demonstrated as a better surface finish in terms of shear strength.
引用
收藏
页码：1243 / 1248
页数：6
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