Advancements in laser diode chip and packaging technologies for application in kW-class fiber laser pumping

被引:25
|
作者
Zucker, Erik [1 ]
Zou, Daniel [1 ]
Zavala, Laura [1 ]
Yu, Hongbo [1 ]
Yalamanchili, Prasad [1 ]
Xu, Lei [1 ]
Xu, Hui [1 ]
Venables, David [1 ]
Skidmore, Jay [1 ]
Rossin, Victor [1 ]
Raju, Reddy [1 ]
Peters, Matthew [1 ]
Liao, Kai-Hsiu [1 ]
Lee, Kong-Weng [1 ]
Kharlamov, Boris [1 ]
Hsieh, Allen [1 ]
Gurram, Rupa [1 ]
Guo, James [1 ]
Guerin, Nicolas [1 ]
Gregg, Jeff [1 ]
Duesterberg, Richard [1 ]
Du, Jihua [1 ]
Demir, Abdullah [1 ]
Cheng, Peter [1 ]
Cheng, Jane [1 ]
Ishiguro, Hiroaki [2 ]
Li, Ruotao [2 ]
Mizoguchi, Yuya [2 ]
Sako, Hiroshi [2 ]
机构
[1] JDSU, 430 North McCarthy Blvd, Milpitas, CA 95035 USA
[2] Amada, Ishida 200, Kanagawa 2591196, Japan
关键词
laser diode; fiber-coupled; multi-emitter package; reliability; high-brightness; pump laser; fiber laser; sheet metal cutting;
D O I
10.1117/12.2038268
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A new 100 mu m aperture, 920nm laser diode chip was developed to improve fiber coupling efficiency and reliability. These chips have been assembled into single-emitter and multi-emitter packages with 105 mu m diameter fiber-coupled output. The single-emitter package is rated for 12W operation, while the multi-emitter package is rated at 140W. Power conversion efficiency is 50%. Over one year of accelerated active life testing has been completed along with a suite of passive, environmental qualification tests. These pumps have been integrated into 2kW, 4kW, and 6kW fiber laser engines that demonstrate excellent brightness, efficiency, and sheet metal cutting quality and speed.
引用
收藏
页数:14
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