The design and optimization of a package for frequency divider at 5.5 GHz

High speed IC-packages require high electric performance, high I/O number high interconnect density low thermal resistance, especially high electromagnetic performance. The parasitics associated with integrated circuit packaging are beginning to affect the performance of the integrated circuit with the rise in operating frequencies. Hence it has become necessary to model various characteristics of the package to provide better understanding of these effects. The package design and analysis should be aided with computer and some CAD/CAA software. This paper introduces the design and optimization of the package for high speed IC, as an example, a package for 5.5GHz frequency divider, includes model, parameter, simulation, analysis and optimization. In the end, the design results of the package are given.