Design and Modeling of Vacuum Packaged MEMS Thermoelectric Power Generator Using Heat Dissipation Path

被引：1
|
作者：
Xie, Jin [1 ]
Lee, Chengkuo [1 ]
机构：
[1] ASTAR, Inst Microelect, Singapore 117685, Singapore
来源：
2008 IEEE INTERNATIONAL CONFERENCE ON SUSTAINABLE ENERGY TECHNOLOGIES (ICSET), VOLS 1 AND 2 | 2008年
关键词：
MEMS; Thermoelectric; Power generator; Energy harvester;
D O I：
10.1109/ICSET.2008.4747067
中图分类号：
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号：
0807 ; 0820 ;
摘要：
A new concept of MEMS based thermoelectric power generator (TPG) is investigated in this study. By using solder based wafer bonding technology, we can bond three pieces of wafers to form vacuum packaged TPG. According to the finite element method and analytical modeling results, the output power per area of device is derived as 68.6 mu W/cm(2) for temperature difference of 6 degrees C between two ends of thermocouple junctions. It shows that the proposed device concept is an effective and low cost approach to enhance the output voltage.
引用
收藏
页码：542 / 545
页数：4
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