Large-scale production of oxidation-resistant Cu@SiO2 core shell nanoparticles for dielectric applications

In this study, we report the large-scale fabrication of Cu@SiO2 nanoparticles with core-shell structure using a modified Stiiber method. The obtained nanoparticles had an average particle size of 300 nm with SiO2 shell about 20 nm and exhibited excellent oxidation resistance and thermal stability in air atmosphere. PVDF based nanocomposites filled with pure Cu and Cu@SiO2 nanoparticles have been prepared by hot press method and their dielectric behavior was investigated. Compared with the Cu/PVDF composite, no typical percolation effect was observed in the Curri;SiO2/PVDF composite and when the content of Cu@SiO(2)tiller reached 20 vol 0/0, the composite exhibited a high dielectric constant of 100 while maintained a low loss value of 0.1 at 1 kHz. Based on their excellent dielectric properties, core shell CuASiO(2) NPs are expected to be ideal fillers to develop polymer-based composites with high dielectric constant and low dielectric loss.